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Series and events of the confref identifiers. Look up an identifier (dblp key, Wikidata, GND, DOI of the proceedings) through the API.
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- Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2026, Chicago, IL, USA, March 8-11, 2026Computer and information sciencese11x1g0
- Tangible, Embedded, and Embodied Interaction (TEI)Computer and information sciencess10b52z
- Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2025, Bordeaux/Talence, France, March 4-7, 2025Computer and information sciencese11x1f3
- Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2024, Cork, Ireland, February 11-14, 2024Computer and information sciencese11x1e5
- Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023Computer and information sciencese11x1d7
- Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction (TEI 2022)Computer and information sciencese11x1c9
- 15th International Conference on Tangible, Embedded, and Embodied Interaction (TEI 2021)Computer and information sciencese11x1bb
- 14th International Conference on Tangible, Embedded, and Embodied Interaction (TEI 2020)Computer and information sciencese11x1ad
As JSON: https://labs.confref.org/api/search?series=s10b52z&from=2020&to=2029